Mckinley clarified directly: the actual contact to use for Infineon is Sabine E. Herlitschka (CEO, Infineon Technologies Austria AG) - not the cold-outreach reliability engineer. Peter knows her personally and she already follows TXproducts on LinkedIn, making her the #1 easiest contact in the whole PE set, not just a footnote. No email/LinkedIn URL attached since this goes through an existing relationship, not a cold channel. Preserved the original engineer contact (Yuhong Chen) in the notes as a secondary/fallback technical contact rather than discarding it. Synced from prospect_scout.json into index.html's embedded array; verified via jsdom.
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98 KiB
JSON
1403 lines
98 KiB
JSON
{
|
||
"generated_from": "market-intelligence/index.html Prospect Scout tab",
|
||
"generated_note": "Company/institution listing with website links, ready for CEO and contact-person enrichment. Name, location, website, source, and reason are populated from two research sweeps + Peter's Phase 1 Contact List; ceo/contact_person/contact_role/contact_email/contact_linkedin/notes are placeholders to fill in next.",
|
||
"total_entries": 73,
|
||
"categories": [
|
||
"Semiconductor Materials & Substrates (GaN/SiC)",
|
||
"Power Electronics (Devices)",
|
||
"WBG Device Manufacturer",
|
||
"Device Testing",
|
||
"Radiation Hardness",
|
||
"Research & Collaborations"
|
||
],
|
||
"entries": [
|
||
{
|
||
"id": "ps-56f7566d",
|
||
"category": "Semiconductor Materials & Substrates (GaN/SiC)",
|
||
"name": "SweGaN AB",
|
||
"location": "Linköping, Sweden",
|
||
"website": "https://swegan.se",
|
||
"source": "sweep",
|
||
"reason": "GaN-on-SiC epiwafer specialist (QuanFINE line) spun off Linköping University; as an epiwafer maker rather than a device maker, plausibly needs external X-ray defect/structural characterization of its own material.",
|
||
"ceo": "Jr-Tai \"Ted\" Chen (co-founder, CEO since Sept 2022)",
|
||
"contact_person": "Christian Sjöstrand",
|
||
"contact_role": "Quality and Production Administrator",
|
||
"contact_email": "christian.sjostrand@swegan.se [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/christian-sj%C3%B6strand-505734218/",
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||
"notes": "Corroborated across two searches (SweGaN AB employer, Linköping University background). Title closer to \"quality administrator\" than a senior Quality Manager, but best quality-adjacent named contact found. | Email pattern-inferred (2026-08-27), confidence notes: name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-6258d8f3",
|
||
"category": "Semiconductor Materials & Substrates (GaN/SiC)",
|
||
"name": "SK Siltron CSS",
|
||
"location": "Auburn, Michigan, USA",
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||
"website": "https://sksiltroncss.com",
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||
"source": "sweep",
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||
"reason": "SiC wafer supplier with a confirmed 2024 supply agreement with Infineon; plausible customer for crystal-defect qualification via synchrotron topography.",
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||
"ceo": "Jianwei Dong (reported, single-source)",
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||
"contact_person": "",
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||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
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||
"notes": "IMPORTANT: SK Siltron announced July 2026 it is winding down/closing its Bay City/Monitor Township, Michigan SiC wafer operation (~140 workers affected). Given the closure, this is not currently a viable cold-outreach target - verify operating status before contacting or deprioritize.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-bd7f82db",
|
||
"category": "Semiconductor Materials & Substrates (GaN/SiC)",
|
||
"name": "TanKeBlue Semiconductor Co., Ltd.",
|
||
"location": "Beijing, China",
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||
"website": "https://en.tankeblue.com",
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||
"source": "sweep",
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||
"reason": "Self-described pioneer of China's SiC substrate industry, founded 2006. Fit inferred from product line only, not yet confirmed against a specific published beamtime need.",
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||
"ceo": "not confirmed - conflicting sources: Liu Wei named \"Chairman\" (2016), Yang Jian described as founder/general manager (2024), a LinkedIn self-labeled \"Dr. Lin Fan\" as \"CEO\" (unverified)",
|
||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "No reliability/quality/BD individual found with a confirmed LinkedIn tied to TanKeBlue - very limited discoverable LinkedIn presence for Chinese staff.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-cdb30795",
|
||
"category": "Semiconductor Materials & Substrates (GaN/SiC)",
|
||
"name": "SICC Co., Ltd.",
|
||
"location": "Jinan, Shandong, China",
|
||
"website": "https://sicc.cc",
|
||
"source": "sweep",
|
||
"reason": "SiC crystal-growth manufacturer. Fit inferred from product line only, no independent confirmation of synchrotron use found.",
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||
"ceo": "Zong Yanmin (Yanmin Zong) - founder, chairman, and CEO, corroborated across two sources",
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||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "One weak lead (\"T Y Ang,\" listed as Consultant tied to SICC Materials, R&D recruiting) was too unclear to report with confidence.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-7e369721",
|
||
"category": "Semiconductor Materials & Substrates (GaN/SiC)",
|
||
"name": "Resonac (formerly Showa Denko)",
|
||
"location": "Tokyo, Japan",
|
||
"website": "https://resonac.com",
|
||
"source": "sweep",
|
||
"reason": "World's largest independent supplier of SiC epitaxial wafers; expanding 150mm capacity to ~50,000 wafers/month and starting 200mm mass production, partnering with Soitec on 200mm bonded SiC substrates.",
|
||
"ceo": "Hidehito Takahashi, Representative Director, President & CEO",
|
||
"contact_person": "Makoto Takeda",
|
||
"contact_role": "General Manager, Device Solutions Business Unit (responsible for Resonac's SiC epitaxial wafer business)",
|
||
"contact_email": "makoto.takeda@resonac.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Strong role match but LinkedIn not verified before agent's search budget ran out - treat as a lead to verify manually. Alternative: Yuki Tanaka, R&D at Resonac (Ibaraki), LinkedIn-confirmed (linkedin.com/in/yuki-tanaka-resonac/), lower seniority. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
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||
"id": "ps-23e015cb",
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||
"category": "Semiconductor Materials & Substrates (GaN/SiC)",
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||
"name": "Coherent Corp.",
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||
"location": "Saxonburg, Pennsylvania, USA",
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||
"website": "https://coherent.com",
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||
"source": "sweep",
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||
"reason": "Producer of SiC substrates/epitaxy up to 200mm diameter for power electronics (formerly II-VI Advanced Materials).",
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||
"ceo": "Jim Anderson",
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||
"contact_person": "Vilas Koinkar, Ph.D.",
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||
"contact_role": "General Manager, Coherent's Silicon Carbide unit",
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||
"contact_email": "vilas..@coherent.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
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"contact_linkedin": "https://www.linkedin.com/in/vilas-koinkar-ph-d-a508845/",
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"notes": "Reasonably confident, cross-referenced across LinkedIn/ZoomInfo/SignalHire. A more senior alternative, Sohail Khan (EVP, Wide-Bandgap Electronics), is a stronger BD-level contact but his LinkedIn match is UNCONFIRMED (ambiguous with a \"SiGe Semiconductor\" profile). | Email pattern-inferred (2026-08-27), confidence notes: underlying contact identity itself was flagged uncertain in prior research. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
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"priority_rank": "",
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||
"priority_tier": "",
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"materials": "",
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||
"ranking_rationale": ""
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},
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||
{
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"id": "ps-8d54f76f",
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"category": "Semiconductor Materials & Substrates (GaN/SiC)",
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"name": "Soitec",
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"location": "Bernin, France",
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"website": "https://soitec.com",
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"source": "sweep",
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"reason": "Independent engineered-substrate specialist; its SmartSiC bonded-SiC technology is adopted by STMicroelectronics for future 200mm substrates.",
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"ceo": "Laurent Rémont (CEO effective April 1, 2026, succeeding Pierre Barnabé) - note the recent transition",
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"contact_person": "Alexandre Berbenni",
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"contact_role": "Product Quality Engineer, SOI",
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"contact_email": "alexandre.berbenni@soitec.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
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"contact_linkedin": "",
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"notes": "UNCONFIRMED - two distinct LinkedIn URLs surfaced for this name, one description suggests early-career/job-seeking status which raises doubt about current Soitec employment. Recommend manual verification before outreach. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; underlying contact identity itself was flagged uncertain in prior research. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
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"priority_rank": "",
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||
"priority_tier": "",
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||
"materials": "",
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||
"ranking_rationale": ""
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||
},
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||
{
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||
"id": "ps-281bbfd4",
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"category": "Semiconductor Materials & Substrates (GaN/SiC)",
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"name": "TekSiC AB",
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||
"location": "Linköping, Sweden",
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||
"website": "https://teksic.com",
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"source": "sweep",
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||
"reason": "Founded 2021, building Europe's first domestic semi-insulating SiC wafer supply for GaN RF/defense/satcom, using a proprietary PVT growth reactor. Early-stage — customer-validation wafers not expected until mid-2027, flag as pre-commercial.",
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"ceo": "Joachim Tollstoy, co-founder & CEO (appointed Oct 2024)",
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||
"contact_person": "",
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||
"contact_role": "",
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||
"contact_email": "",
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||
"contact_linkedin": "",
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"notes": "Small (~14-employee) 2021 Linköping University spinout; team page names only Tollstoy, no dedicated reliability/quality/R&D-lead contact found beyond the CEO.",
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"priority_rank": "",
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||
"priority_tier": "",
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||
"materials": "",
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||
"ranking_rationale": ""
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||
},
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||
{
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"id": "ps-51c5ddf6",
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"category": "Semiconductor Materials & Substrates (GaN/SiC)",
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||
"name": "Kyma Technologies",
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||
"location": "Raleigh, North Carolina, USA",
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||
"website": "https://kymatech.com",
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||
"source": "sweep",
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||
"reason": "US supplier of bulk GaN substrates; partnership with Qromis demonstrated 200mm GaN-on-QST engineered substrates.",
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||
"ceo": "Heather Splawn, President & CEO",
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||
"contact_person": "Kevin Udwary",
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"contact_role": "Director of Engineering",
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"contact_email": "kevin.udwary@kymatech.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
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"contact_linkedin": "",
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"notes": "Role/tenure confirmed via ZoomInfo/RocketReach but no LinkedIn URL surfaced - recommend a manual LinkedIn search to confirm before outreach. Jacob Leach (CTO) is a plausible alternate, also unconfirmed on LinkedIn. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; underlying contact identity itself was flagged uncertain in prior research. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
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"priority_rank": "",
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||
"priority_tier": "",
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||
"materials": "",
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||
"ranking_rationale": ""
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||
},
|
||
{
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||
"id": "ps-dde7c64d",
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"category": "Power Electronics (Devices)",
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"name": "Infineon Technologies AG",
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||
"location": "Neubiberg, Germany",
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"website": "https://infineon.com",
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||
"source": "both",
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||
"reason": "Peter's Phase 1 list + this sweep. Leading supplier of SiC MOSFETs and GaN power ICs at scale; large-volume production makes epitaxial/interface defect characterization commercially relevant.",
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||
"ceo": "Jochen Hanebeck",
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||
"contact_person": "Sabine E. Herlitschka",
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||
"contact_role": "CEO, Infineon Technologies Austria AG",
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||
"contact_email": "",
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||
"contact_linkedin": "",
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||
"notes": "Confirmed 2026-09-02 by Mckinley: Sabine E. Herlitschka is the contact to use, not the cold-outreach engineer below. Peter knows her personally and she already follows TXproducts on LinkedIn - this is an existing warm relationship, not a cold guess, so no email/LinkedIn URL is attached (outreach goes through the existing connection, not a cold channel). Promoted to easiest-to-acquire #1 in the PE Kickoff Dossier. Secondary/fallback technical contact at the parent entity, unaffected by this change: Yuhong Chen, Certified Reliability Engineer, https://www.linkedin.com/in/yuhong-chen-b57816b9/, yuhong.chen@infineon.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach].",
|
||
"priority_rank": 2,
|
||
"priority_tier": "Tier 1",
|
||
"materials": "SiC + GaN",
|
||
"ranking_rationale": "\"Strong\" fit rating (original research). Market leader (CoolSiC). Reliability Engineer contact, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-c585f9ef",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Wolfspeed, Inc.",
|
||
"location": "Durham, North Carolina, USA",
|
||
"website": "https://wolfspeed.com",
|
||
"source": "both",
|
||
"reason": "Peter's Phase 1 list + this sweep. Largest dedicated SiC materials/wafer producer globally (Mohawk Valley fab) that also makes devices; micropipe/dislocation density is a well-documented synchrotron-topography use case in SiC crystal-growth literature.",
|
||
"ceo": "Robert Feurle",
|
||
"contact_person": "David Emerson, Ph.D.",
|
||
"contact_role": "Executive Vice President and Chief Operating Officer",
|
||
"contact_email": "david.emerson@wolfspeed.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/david-emerson-43a757a9/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch. LinkedIn profile personally verified by Mckinley 2026-08-20.",
|
||
"priority_rank": 5,
|
||
"priority_tier": "Tier 1",
|
||
"materials": "SiC",
|
||
"ranking_rationale": "Largest pure-play SiC company. COO contact personally LinkedIn-verified by Mckinley."
|
||
},
|
||
{
|
||
"id": "ps-dac7b09c",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "onsemi",
|
||
"location": "DE / US / Asia / Canada",
|
||
"website": "https://www.onsemi.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. SiC power semiconductor supplier (automotive/industrial), multi-region manufacturing footprint.",
|
||
"ceo": "Hassane El-Khoury",
|
||
"contact_person": "Amit Nangia",
|
||
"contact_role": "Director, NPD Quality and Reliability Engineering",
|
||
"contact_email": "amit.nangia@onsemi.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/amit-nangia/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 3,
|
||
"priority_tier": "Tier 1",
|
||
"materials": "SiC",
|
||
"ranking_rationale": "Major SiC player (EliteSiC). Director-level Quality/Reliability Engineering contact, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-8c04ace7",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "STMicroelectronics",
|
||
"location": "CH / FR / IT",
|
||
"website": "https://www.st.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. SiC/GaN power devices; already has named researchers publishing ESRF beamtime work on phase-change memory and 3D IC characterisation — a direct synchrotron-use precedent.",
|
||
"ceo": "Jean-Marc Chery",
|
||
"contact_person": "Emmanuel Solari",
|
||
"contact_role": "Reliability / Power Delivery / Thermal Analysis",
|
||
"contact_email": "emmanuel.solari@st.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/emmanuel-solari-11914919/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 6,
|
||
"priority_tier": "Tier 2",
|
||
"materials": "SiC + GaN",
|
||
"ranking_rationale": "Established SiC/GaN player. Reliability/Power Delivery/Thermal Analysis contact, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-9def54e1",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "ROHM",
|
||
"location": "Japan",
|
||
"website": "https://www.rohm.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Major Japanese SiC power device manufacturer.",
|
||
"ceo": "Katsumi Azuma",
|
||
"contact_person": "Igor Kasko",
|
||
"contact_role": "ROHM Semiconductor Europe - SiC MOSFET thermal characterization",
|
||
"contact_email": "igor.kasko@rohm.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/igor-kasko-4a9118b/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 7,
|
||
"priority_tier": "Tier 2",
|
||
"materials": "SiC",
|
||
"ranking_rationale": "Major Japanese SiC manufacturer. Thermal characterization contact, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-583e24ea",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Renesas",
|
||
"location": "Japan",
|
||
"website": "https://www.renesas.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. GaN/SiC power device manufacturer; acquired GaN Systems in 2023 (see WBG Device Manufacturer division).",
|
||
"ceo": "Hidetoshi Shibata",
|
||
"contact_person": "Alex Zhou",
|
||
"contact_role": "Automotive-grade Quality Systems / Reliability Testing",
|
||
"contact_email": "alex.zhou@renesas.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/alexzhoufs/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 8,
|
||
"priority_tier": "Tier 2",
|
||
"materials": "GaN + SiC",
|
||
"ranking_rationale": "GaN/SiC power device maker. Quality Systems/Reliability contact, LinkedIn confirmed, though role is automotive-specific."
|
||
},
|
||
{
|
||
"id": "ps-feb3306b",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Power Integrations",
|
||
"location": "USA",
|
||
"website": "https://www.power.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. GaN power IC manufacturer.",
|
||
"ceo": "Dr. Jennifer A. Lloyd",
|
||
"contact_person": "Bhavesh Patel",
|
||
"contact_role": "Senior Manager, Reliability Engineering",
|
||
"contact_email": "bhavesh.patel@power.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/bhavesh-patel-03bb5b4/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 9,
|
||
"priority_tier": "Tier 2",
|
||
"materials": "GaN",
|
||
"ranking_rationale": "\"Moderate\" fit rating. GaN Power IC manufacturer. Senior Manager Reliability Engineering, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-066c72ea",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Navitas Semiconductor",
|
||
"location": "Torrance, California, USA",
|
||
"website": "https://navitassemi.com",
|
||
"source": "both",
|
||
"reason": "Peter's Phase 1 list + this sweep. GaNFast power IC maker.",
|
||
"ceo": "Chris Allexandre",
|
||
"contact_person": "Anthony Schiro",
|
||
"contact_role": "VP Quality & Sustainability",
|
||
"contact_email": "anthony.schiro@navitassemi.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/aschiro/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 4,
|
||
"priority_tier": "Tier 1",
|
||
"materials": "GaN + SiC",
|
||
"ranking_rationale": "\"Strong\" fit rating. GaN leader (GaNFast) + SiC via GeneSiC. VP Quality & Sustainability, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-24415272",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "EPC (Efficient Power Conversion)",
|
||
"location": "USA",
|
||
"website": "https://www.epc-co.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. GaN FET manufacturer.",
|
||
"ceo": "Alex Lidow",
|
||
"contact_person": "Bel Lazar",
|
||
"contact_role": "COO, EPC / CEO, EPC Space",
|
||
"contact_email": "bel.lazar@epc-co.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/bel-lazar/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 11,
|
||
"priority_tier": "Tier 3",
|
||
"materials": "GaN",
|
||
"ranking_rationale": "\"Moderate\" fit. GaN FET leader, but contact is COO-level - harder to engage with a cold pitch than an engineer would be."
|
||
},
|
||
{
|
||
"id": "ps-8aa5554a",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Innoscience",
|
||
"location": "China",
|
||
"website": "https://www.innoscience.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Chinese GaN power device manufacturer.",
|
||
"ceo": "Wu Jingang",
|
||
"contact_person": "Denis Marcon",
|
||
"contact_role": "General Manager, Innoscience Europe (unverified beyond LinkedIn search snippet)",
|
||
"contact_email": "denis.marcon@innoscience.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://be.linkedin.com/in/marcondenis",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 16,
|
||
"priority_tier": "Tier 4",
|
||
"materials": "GaN",
|
||
"ranking_rationale": "Real technical fit, but original research flagged serious China-based logistics/export-control friction. Contact identity unverified beyond a search snippet."
|
||
},
|
||
{
|
||
"id": "ps-01033a67",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "GaN Systems Inc.",
|
||
"location": "Ottawa, Ontario, Canada",
|
||
"website": "https://www.gansystems.com",
|
||
"source": "both",
|
||
"reason": "Peter's Phase 1 list + this sweep. Fabless GaN power switching semiconductor developer, acquired by Infineon in 2023 — Peter's sheet also lists its website as infineon.com, consistent with the acquisition. Flagged as uncertain whether it still operates as an independent prospect entity or is now folded fully into Infineon.",
|
||
"ceo": "Jochen Hanebeck",
|
||
"contact_person": "Kai Ha",
|
||
"contact_role": "Reliability Engineering Manager, Infineon (Ottawa) - formerly GaN Systems",
|
||
"contact_email": "kai.ha@infineon.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://ca.linkedin.com/in/kai-ha-947292a9",
|
||
"notes": "Carried over from Phase 1 PE-12 batch. GaN Systems has been a wholly-owned Infineon subsidiary since Oct 2023 - CEO reflects Infineon parent.",
|
||
"priority_rank": 14,
|
||
"priority_tier": "Tier 3",
|
||
"materials": "GaN",
|
||
"ranking_rationale": "Originally \"Weak\" fit rating. Now just an Infineon business unit - outreach here mostly overlaps with the Infineon entry above."
|
||
},
|
||
{
|
||
"id": "ps-1a32d960",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Vishay Intertechnology",
|
||
"location": "USA",
|
||
"website": "https://www.vishay.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Power discrete semiconductor manufacturer.",
|
||
"ceo": "Joel Smejkal",
|
||
"contact_person": "Finn Monaghan",
|
||
"contact_role": "Power Device Reliability Testing (SiC/GaN)",
|
||
"contact_email": "finn.monaghan@vishay.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/finn-monaghan-57b8801aa/",
|
||
"notes": "Carried over from Phase 1 PE-12 batch.",
|
||
"priority_rank": 10,
|
||
"priority_tier": "Tier 2",
|
||
"materials": "SiC + GaN",
|
||
"ranking_rationale": "Established power discretes maker. Power Device Reliability Testing (SiC/GaN) contact, LinkedIn confirmed."
|
||
},
|
||
{
|
||
"id": "ps-c761ce8e",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Mitsubishi Electric",
|
||
"location": "Tokyo, Japan",
|
||
"website": "https://www.mitsubishielectric.com",
|
||
"source": "sweep",
|
||
"reason": "Long-standing SiC power module producer (first all-SiC module for Shinkansen trains, 2015); new 200mm SiC wafer fab completed in Kumamoto, Oct 2025; states a goal to be #1 power semiconductor maker by 2030.",
|
||
"ceo": "Kei Uruma (Representative Executive Officer, President & CEO, Mitsubishi Electric Corporation)",
|
||
"contact_person": "Cordula Olszamowski",
|
||
"contact_role": "Expert, Quality Management — Mitsubishi Electric Europe (Semiconductor business unit)",
|
||
"contact_email": "cordula.olszamowski@mitsubishielectric.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "",
|
||
"notes": "Confirmed via Mitsubishi Electric Europe Semiconductor LinkedIn showcase page content. No personal LinkedIn profile URL found despite searching - left blank rather than guess. Role is quality management for the semiconductor division broadly, not confirmed as SiC-specific.",
|
||
"priority_rank": 15,
|
||
"priority_tier": "Tier 4",
|
||
"materials": "SiC",
|
||
"ranking_rationale": "No LinkedIn found for contact. Contact role is general quality management, not SiC-specific."
|
||
},
|
||
{
|
||
"id": "ps-902c6b24",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Fuji Electric",
|
||
"location": "Tokyo, Japan",
|
||
"website": "https://www.fujielectric.com",
|
||
"source": "sweep",
|
||
"reason": "Established SiC device/module manufacturer (hybrid Si-IGBT/SiC and full-SiC modules); active EV partnership with Denso on SiC.",
|
||
"ceo": "Michihiro Kitazawa (President & CEO, Fuji Electric Co., Ltd.)",
|
||
"contact_person": "Yuta Fukushima",
|
||
"contact_role": "R&D Engineer, Fuji Electric Japan — GaN Power Device development",
|
||
"contact_email": "yuta.fukushima@fujielectric.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/yuta-fukushima-3bb8985b/",
|
||
"notes": "Reasonable confidence - profile explicitly ties him to GaN power device R&D at Fuji Electric Japan. R&D rather than a Reliability/Quality/Test title; no clearly power-semiconductor-specific reliability/quality contact surfaced.",
|
||
"priority_rank": 13,
|
||
"priority_tier": "Tier 3",
|
||
"materials": "SiC + GaN",
|
||
"ranking_rationale": "Established SiC/GaN maker. Contact is R&D, not the reliability/quality buyer role."
|
||
},
|
||
{
|
||
"id": "ps-0cb1a213",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Nexperia",
|
||
"location": "Nijmegen, Netherlands (WBG fab in Hamburg, Germany)",
|
||
"website": "https://nexperia.com",
|
||
"source": "sweep",
|
||
"reason": "GaN FET (CCPAK) and SiC MOSFET lines, including devices co-developed with Mitsubishi Electric; $200M investment announced to expand WBG production at its Hamburg fab — notably close to TXproducts' DESY Hamburg beamtime connection.",
|
||
"ceo": "Stefan Tilger (interim/acting CEO as of Feb 2026 Dutch court ruling; former CFO, took over after Zhang Xuezheng's suspension - governance situation unstable, verify currency before outreach)",
|
||
"contact_person": "Sibasish Laha",
|
||
"contact_role": "Product Quality Engineer – SiC, Nexperia (Hamburg WBG fab)",
|
||
"contact_email": "sibasish.laha@nexperia.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://de.linkedin.com/in/sibasish-laha-5aa8a6105",
|
||
"notes": "High confidence - title and location (Hamburg, Nexperia SiC) match exactly; LinkedIn activity on SiC device degradation/power-cycling reliability tests corroborates the role.",
|
||
"priority_rank": 1,
|
||
"priority_tier": "Tier 1",
|
||
"materials": "SiC + GaN",
|
||
"ranking_rationale": "Hamburg WBG fab - same city as TXproducts' DESY beamtime source. High-confidence SiC Product Quality Engineer contact."
|
||
},
|
||
{
|
||
"id": "ps-fee04fbe",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Semikron Danfoss",
|
||
"location": "Nuremberg, Germany / Denmark",
|
||
"website": "https://semikron-danfoss.com",
|
||
"source": "sweep",
|
||
"reason": "Largest chip-independent power module manufacturer, partnered with all major SiC chip suppliers; dedicated SiC MOSFET/hybrid module lines up to 600A/1700V.",
|
||
"ceo": "Dr. Dominic Dorfner (President, Semikron Danfoss) - flag: multiple 2026 sources report Dorfner named incoming CEO of Jenoptik (~Oct 2026), tenure here may be ending, verify currency.",
|
||
"contact_person": "Dr. Carsten Götte",
|
||
"contact_role": "SVP, Automotive Power Modules Division, Semikron Danfoss",
|
||
"contact_email": "carsten.goette@semikron-danfoss.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/dr-carsten-g%C3%B6tte-b9345333/",
|
||
"notes": "BD/leadership-level match rather than Reliability/Quality/Test - named directly in the Nexperia-Semikron Danfoss SiC power module collaboration press release, confirming SiC-relevant remit.",
|
||
"priority_rank": 12,
|
||
"priority_tier": "Tier 3",
|
||
"materials": "SiC",
|
||
"ranking_rationale": "Dedicated SiC module maker. Contact is BD/leadership, not reliability-specific; president may be departing for Jenoptik."
|
||
},
|
||
{
|
||
"id": "ps-049de716",
|
||
"category": "Power Electronics (Devices)",
|
||
"name": "Microchip Technology",
|
||
"location": "Chandler, Arizona, USA",
|
||
"website": "https://www.microchip.com",
|
||
"source": "sweep",
|
||
"reason": "Scalable GaN power IC and SiC discrete/module portfolio for industrial, automotive, and aerospace/defense. Also has a distinct rad-hard/rad-tolerant space product line, listed separately under Radiation Hardness.",
|
||
"ceo": "Steve Sanghi (Chair, President & CEO, Microchip Technology Incorporated)",
|
||
"contact_person": "Ash Kumar",
|
||
"contact_role": "Sr. Quality Manager, Microchip Technology (Chandler, AZ)",
|
||
"contact_email": "ash.kumar@microchip.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source, reference only, not cleared for cold outreach]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/ashkumar1/",
|
||
"notes": "UNCONFIRMED SiC-specificity - confirmed Sr. Quality Manager at Chandler HQ (same site as power/SiC line), responsibilities include reliability monitoring of new process tech, but no source ties him explicitly to SiC/power discretes vs. broader portfolio. Confirm before outreach.",
|
||
"priority_rank": 17,
|
||
"priority_tier": "Tier 4",
|
||
"materials": "GaN + SiC",
|
||
"ranking_rationale": "Contact's SiC-specificity itself is unconfirmed. Company aggressively blocks web access (403s), lower actionable confidence."
|
||
},
|
||
{
|
||
"id": "ps-3f1b7ef4",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "Cissoid",
|
||
"location": "Belgium",
|
||
"website": "https://www.cissoid.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. SiC/GaN devices for extreme-temperature applications.",
|
||
"ceo": "Dave Hutton (President/CEO) - note: older press (~2008-2019) names Tony Denayer as CEO, current sources point to Hutton",
|
||
"contact_person": "Etienne Vanzieleghem",
|
||
"contact_role": "VP Engineering",
|
||
"contact_email": "etienne.vanzieleghem@cissoid.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "No confirmed LinkedIn URL found (only RocketReach/company-team-page mentions). R&D Lead category match. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-07e66b1a",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "WeEn Semiconductors",
|
||
"location": "China / Netherlands",
|
||
"website": "https://www.ween-semi.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. SiC MOSFET manufacturer.",
|
||
"ceo": "Markus Mosen (CEO, also Vice Chairman of the Board)",
|
||
"contact_person": "Sam Chen",
|
||
"contact_role": "Chief Operating Officer (portfolio explicitly includes Quality function, per WeEn's own leadership bio, alongside Manufacturing/Operations/IT/Supply Chain)",
|
||
"contact_email": "sam.chen@ween-semi.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Follow-up pass: more senior than target categories (COO, not manager/engineer) - partial win, named person tied to Quality but no LinkedIn found despite multiple search angles (every \"Sam Chen\" + WeEn/Shanghai result was a different person). No dedicated Quality/Reliability manager below him surfaced despite trade-show/press-release/LinkedIn employee-list angles. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-3b700c40",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "Solitron Devices",
|
||
"location": "USA",
|
||
"website": "https://solitrondevices.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Discrete power devices for Hi-Rel/space applications — also relevant to Radiation Hardness.",
|
||
"ceo": "Tim Eriksen (CEO since July 2016); Mark Matson serves as President & COO",
|
||
"contact_person": "Jack Worthen",
|
||
"contact_role": "Vice President, Sales (military & aerospace markets)",
|
||
"contact_email": "jack.worthen@solitrondevices.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/jack-worthen-3165899/",
|
||
"notes": "Follow-up pass: high confidence - LinkedIn post from this exact profile references \"Solitron Devices Acquires Micro Engineering,\" matching Solitron's own press release. BD-category contact (lowest priority) since no named Quality/Reliability/Test/R&D individual could be found after checking SEC filings, LinkedIn site-search, and job postings. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-6ca32c77",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "NexGen Power Systems",
|
||
"location": "USA",
|
||
"website": "https://www.nexgenpowersystems.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. GaN power device manufacturer.",
|
||
"ceo": "Dual leadership - Dinesh Ramanathan (President & CEO) and Dr. Shahin Sharifzadeh (co-CEO)",
|
||
"contact_person": "Andrew Edwards",
|
||
"contact_role": "Principal GaN Device Engineer (R&D - vertical GaN device technology)",
|
||
"contact_email": "andrew.edwards@nexgenpowersystems.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/andrewpedwards/",
|
||
"notes": "Follow-up pass: found via conference/technical-paper authorship (ISPSD 2023, vertical GaN Fin-JFETs presentation for NexGen), cross-confirmed via ZoomInfo and TheOrg. CAUTION: a second similarly-named LinkedIn profile exists (andrew-edwards-42b8ba, San Jose) - do NOT use that one, it is not corroborated as the NexGen employee. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-65bb7807",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "GaNPower International",
|
||
"location": "Canada",
|
||
"website": "https://iganpower.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. GaN power device manufacturer.",
|
||
"ceo": "not confirmed - directors on record: Mangwa Li, Robert Taylor, Zhanming (Simon) Li; no one clearly titled CEO/President found",
|
||
"contact_person": "Robert Taylor",
|
||
"contact_role": "VP, Business Development",
|
||
"contact_email": "robert.taylor@iganpower.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "UNCONFIRMED LinkedIn - title/employer confirmed via ZoomInfo but \"Robert Taylor\" is a very common name and his specific profile could not be isolated with confidence. Verify manually on LinkedIn before outreach. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; underlying contact identity itself was flagged uncertain in prior research. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-ed79351f",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "Toshiba Electronic Devices",
|
||
"location": "Japan",
|
||
"website": "https://toshiba.semicon-storage.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. SiC and power discrete device manufacturer.",
|
||
"ceo": "Taro Shimada (Director, President & CEO, Toshiba Electronic Devices & Storage)",
|
||
"contact_person": "Nobuyuki Wakai",
|
||
"contact_role": "General Manager, Semiconductor Quality & Reliability Center",
|
||
"contact_email": "nobuyuki.wakai@toshiba.semicon-storage.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/nobuyuki-wakai-39562853/",
|
||
"notes": "Good confidence - profile explicitly states his role overseeing Quality & Reliability for Toshiba Devices and Storage. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-c5ad3fde",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "X-FAB Silicon Foundries SE",
|
||
"location": "Erfurt, Germany (registered seat Tessenderlo, Belgium)",
|
||
"website": "https://xfab.com",
|
||
"source": "sweep",
|
||
"reason": "Self-described first pure-play foundry offering SiC and GaN process technologies; as a foundry serving many fabless WBG designers, defect/process characterization services are directly relevant.",
|
||
"ceo": "Damien Macq, CEO of X-FAB Group since Feb 2026 (succeeding Rudi De Winter). The Erfurt WBG/SiC fab site has its own site CEO, Dr. Gabriel Kittler.",
|
||
"contact_person": "Yon Lee",
|
||
"contact_role": "Director, WBG R&D / Process Integration",
|
||
"contact_email": "yon.lee@xfab.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/yon-lee-587144230/",
|
||
"notes": "Based at X-FAB's Texas (Lubbock) WBG operation, not Erfurt specifically, but same corporate entity. Reasonable confidence for R&D Lead. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-7ca52da3",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "Transphorm Inc.",
|
||
"location": "Goleta, California, USA",
|
||
"website": "https://www.transphormusa.com",
|
||
"source": "sweep",
|
||
"reason": "GaN FET maker for high-voltage power conversion, acquired by Renesas (completed June 2024, corrected — an earlier pass wrongly attributed this to Infineon) — independent prospect status uncertain, confirm before outreach.",
|
||
"ceo": "No longer standalone - acquired by Renesas, completed June 20, 2024. Renesas overall CEO: Hidetoshi Shibata; GaN/power business led at SVP/GM level by Chris Allexandre.",
|
||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "Same pattern as GaN Systems/Infineon - no distinct standalone local CEO. Candidates found (Mike Moschitto = Sr. Facility/EHS Manager, Marcia Moore = Director Product Engineering GaN) did not cleanly match target roles, left blank rather than guess.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-62cc7b60",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "GeneSiC Semiconductor",
|
||
"location": "Dulles, Virginia, USA",
|
||
"website": "https://genesic.com",
|
||
"source": "sweep",
|
||
"reason": "SiC pioneer (founded 2004) making SiC rectifiers, transistors, and thyristors; acquired by Navitas Semiconductor in 2022 but still operates as a distinct SiC device brand/line.",
|
||
"ceo": "No longer standalone - acquired by Navitas Semiconductor (2022). Founder Ranbir Singh is now EVP for the GeneSiC business line at Navitas.",
|
||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "Treat as a Navitas Semiconductor business unit going forward, same acquisition pattern as Transphorm/Renesas and GaN Systems/Infineon.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-6f059fde",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "Qorvo Power Device Solutions (ex-United Silicon Carbide/UnitedSiC)",
|
||
"location": "Princeton, New Jersey, USA",
|
||
"website": "https://www.qorvo.com",
|
||
"source": "sweep",
|
||
"reason": "Specialist SiC FET/JFET/Schottky diode portfolio (80+ devices), including 750V/5.9mΩ Gen4 SiC FETs; acquired by Qorvo in 2021, operates within Qorvo's Infrastructure & Defense Products unit as a distinct SiC line.",
|
||
"ceo": "Chris Dries (former UnitedSiC President & CEO, now GM of Qorvo's Power Device Solutions business unit); parent Qorvo's corporate CEO last reported as Robert Bruggeworth, not independently re-verified this session",
|
||
"contact_person": "Jing Chen",
|
||
"contact_role": "Senior Customer Quality Engineer",
|
||
"contact_email": "jing.chen@qorvo.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/jing-chen-a8379613/",
|
||
"notes": "Moderate confidence - profile references SiC wafer fab process, QRA, and customer quality, but not 100% confirmed she sits within the ex-UnitedSiC/Power Device Solutions unit specifically vs. broader Qorvo quality org. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-4566abfc",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "Powdec K.K.",
|
||
"location": "Oyama City, Tochigi, Japan",
|
||
"website": "https://www.powdec.co.jp/english/",
|
||
"source": "sweep",
|
||
"reason": "Specialist in GaN-on-GaN epitaxial wafers and devices, holder of PSJ-GaN (Polarization Super Junction GaN) patents. Acquired by Sanken Electric in March 2025.",
|
||
"ceo": "Hironobu Narui (President) per available sources - note Powdec was acquired by Sanken Electric, completed April 1 2025, leadership/reporting lines may have changed since",
|
||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "A \"Ted Kang\" surfaced, possibly a US-side sales/BD contact for Powdec Technologies USA (San Jose), but title/role could not be confirmed with enough confidence - left blank. Worth a direct LinkedIn company-page check given the recent acquisition.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-de35afd6",
|
||
"category": "WBG Device Manufacturer",
|
||
"name": "STARPOWER Semiconductor",
|
||
"location": "Jiaxing, Zhejiang, China",
|
||
"website": "https://www.powersemi.com",
|
||
"source": "sweep",
|
||
"reason": "IGBT/SiC module manufacturer, ranked #5 globally in IGBT modules (2022, #1 among Chinese firms), Shanghai-listed (603290), with R&D/HQ presence in Switzerland and Germany.",
|
||
"ceo": "Shen Hua (沈华) - Chairman, General Manager, and legal representative per 2024/2025 annual report filings",
|
||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "An early search result incorrectly suggested \"Jie Liu\" as CEO - not corroborated by primary filings, discarded. An \"Amy Chen\" surfaced as affiliated with StarPower Semiconductor on LinkedIn but role unconfirmed, left as not found.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-a78c5ac3",
|
||
"category": "Device Testing",
|
||
"name": "Applied Technical Services (ATS)",
|
||
"location": "USA",
|
||
"website": "https://atslab.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Reliability and radiation testing for aerospace semiconductors. Now operates under SGS (see SGS SA entry below) but continues under its own brand.",
|
||
"ceo": "Marcus Maguire (CEO of Applied Technical Services, LLC as of early 2026, following SGS's completed acquisition, closed Jan 13 2026) - LinkedIn unverified in depth: linkedin.com/in/marcus-maguire-a8b20312/",
|
||
"contact_person": "Kris Hartojo",
|
||
"contact_role": "Director of Operations, Radiation Test Solutions, Inc. (ATS's radiation-effects testing subsidiary, part of the same \"ATS family of companies\")",
|
||
"contact_email": "kris.hartojo@atslab.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/kris-hartojo-08437b14",
|
||
"notes": "Follow-up pass: found via RTS's own Senior Staff bios page (\"Kris H., Director of Operations, joined 2016\"), matched to full name via LinkedIn search. Note: this is technically a contact at the RTS subsidiary rather than the ATS parent directly - independently corroborates the separate RTS entry's existing contact (Dr. Nabil Mansour) as a real, current team. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-79dc3a78",
|
||
"category": "Device Testing",
|
||
"name": "AAA Engineering & Test Lab",
|
||
"location": "USA",
|
||
"website": "https://aaactl.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Hi-Rel/space qualification, RadHard testing.",
|
||
"ceo": "Eric Young, Chief Executive Officer (confirmed via aaactl.com About Us, alongside Hayden Green, General Manager)",
|
||
"contact_person": "Reed Coffey",
|
||
"contact_role": "Technical Sales Manager",
|
||
"contact_email": "reed.coffey@aaactl.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Reed Coffey (Technical Sales Manager) confirmed by name/title/photo on company site. Only a company-level LinkedIn page found (linkedin.com/company/aaa-test-lab-inc); no individual profile located - session's search quota was exhausted before a proper person-search could be run. Follow-up manual LinkedIn search recommended. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-c09c573e",
|
||
"category": "Device Testing",
|
||
"name": "Radiation Test Solutions (RTS)",
|
||
"location": "Colorado Springs, Colorado, USA",
|
||
"website": "https://radiationtestsolutions.com",
|
||
"source": "both",
|
||
"reason": "Peter's Phase 1 list + this sweep (moved here from Radiation Hardness to match Peter's placement). Independent flash-X-ray/heavy-ion/TID radiation-hardness qualification lab (MIL-STD-750/883), spun out of Cobham's radiation-test business in 2020.",
|
||
"ceo": "\"Jen A.\" - RTS lists senior staff by first name + last initial only on its public site, full name not disclosed",
|
||
"contact_person": "Dr. Nabil Mansour",
|
||
"contact_role": "Engineering Manager",
|
||
"contact_email": "..mansour@radiationtestsolutions.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Dr. Nabil Mansour (Engineering Manager) confirmed via RTS's own Senior Staff page: joined 2018, 10+ years in radiation effects, PhD, 25+ patents. No LinkedIn located - same search-quota limitation. RTS confirmed part of the Applied Technical Services, LLC family of companies (same as ATS entry, this JSON). | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-637da0a9",
|
||
"category": "Device Testing",
|
||
"name": "BEAMIDE",
|
||
"location": "EU",
|
||
"website": "https://www.beamide.com",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Irradiation testing per ECSS/ESA standards.",
|
||
"ceo": "none listed - BEAMIDE's About Us page does not name a distinct CEO/President, consistent with a small founder-led operation",
|
||
"contact_person": "Efe Alpat",
|
||
"contact_role": "Co-founder & Chief Business Officer",
|
||
"contact_email": "efe.alpat@beamide.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Efe Alpat (Chief Business Officer) confirmed on beamide.com About Us page (listed as \"Efe\" only, no surname on the visible page, but matches prior research). Only a company LinkedIn page found (linkedin.com/company/beamide-srl); individual profile not located under this session's search constraints. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-0f7c65b9",
|
||
"category": "Device Testing",
|
||
"name": "Reltech Limited",
|
||
"location": "Cambridgeshire, UK",
|
||
"website": "https://reltech.co.uk",
|
||
"source": "sweep",
|
||
"reason": "Independent lab (est. 1976) providing semiconductor qualification/reliability testing (HTOL, HAST, LTOL, THB) to fabless/IDM customers; explicitly positions itself as independent.",
|
||
"ceo": "Paul Tuffin, Managing Director (per aggregator data, not independently confirmed via LinkedIn - moderate confidence)",
|
||
"contact_person": "Srikanth Katra",
|
||
"contact_role": "Director of Engineering",
|
||
"contact_email": "srikanth.katra@reltech.co.uk [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://uk.linkedin.com/in/srikanth-katra-148628202",
|
||
"notes": "Good R&D Lead match, confirmed current via LinkedIn snippet. Reltech's own site names almost no current staff - Katra was the only confirmed current, named, role-matched contact. | Email pattern-inferred (2026-08-27), confidence notes: name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-b563ef67",
|
||
"category": "Device Testing",
|
||
"name": "Integra Technologies",
|
||
"location": "Wichita, Kansas, USA",
|
||
"website": "https://integra-tech.com",
|
||
"source": "sweep",
|
||
"reason": "Qualification/reliability testing for semiconductor manufacturers and military/space/aerospace/automotive OEMs, explicitly including high-voltage GaN. Some branding/location inconsistency found across sources — verify HQ directly before outreach.",
|
||
"ceo": "Brett Robinson, President & CEO - LinkedIn: https://www.linkedin.com/in/brett-robinson-07239840/",
|
||
"contact_person": "John Montgomery",
|
||
"contact_role": "General Manager, Integra Technologies (Wichita) - formerly VP of Operations",
|
||
"contact_email": "john.montgomery@integra-tech.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/john-montgomery-42a8b841/",
|
||
"notes": "Integra was acquired by Micross Components (Apollo/Behrman/BlackRock-backed) Jan 2025; Robinson appears to remain President/CEO of the subsidiary. No Quality/Reliability/Test/BD contact found (Integra's Management Team/Quality pages returned 403). Montgomery is the closest identifiable named current contact, though GM/Ops rather than an exact role match. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-60ab4824",
|
||
"category": "Device Testing",
|
||
"name": "SGS SA",
|
||
"location": "Geneva, Switzerland",
|
||
"website": "https://sgs.com",
|
||
"source": "sweep",
|
||
"reason": "Global third-party AEC-Q101/AEC-Q102 semiconductor reliability/qualification testing, including automotive-grade discretes and power devices.",
|
||
"ceo": "not found (declined to report the generic SGS Group CEO - looked specifically for the semiconductor division, no result)",
|
||
"contact_person": "Xu Chuangge",
|
||
"contact_role": "Senior Manager, SGS Semiconductor and Reliability Business Division",
|
||
"contact_email": "xu.chuangge@sgs.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "LOW CONFIDENCE - title/division from a single 2023 mention (Shenzhen Semiconductor Tech Forum), no LinkedIn profile located, Chinese-name transliteration makes matching unreliable. Treat as a lead to verify manually, not outreach-ready. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-3cd755b2",
|
||
"category": "Device Testing",
|
||
"name": "PCsemic (Chongqing Pingchuang Institute of Semiconductors Co., Ltd.)",
|
||
"location": "Chongqing, China",
|
||
"website": "https://pcsemic.com",
|
||
"source": "sweep",
|
||
"reason": "Operates a dedicated Power Device Reliability Laboratory (HTRB/HTGB chip-level, H3TRB/TC/HAST package-level). Independence from single device makers not yet confirmed.",
|
||
"ceo": "",
|
||
"contact_person": "",
|
||
"contact_role": "",
|
||
"contact_email": "",
|
||
"contact_linkedin": "",
|
||
"notes": "No named individuals found anywhere on pcsemic.com (About Us, News, Reliability pages checked) or on LinkedIn. Likely needs a different research channel (Chinese business registries / China-market-specific outreach) rather than Western web search.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-c6f27550",
|
||
"category": "Device Testing",
|
||
"name": "Presto Engineering",
|
||
"location": "Caen, France",
|
||
"website": "https://www.presto-eng.com",
|
||
"source": "sweep",
|
||
"reason": "Independent semiconductor test/failure-analysis/qualification house on a former NXP facility; >€50M invested across 4 test floors, explicit die-, package-, and board-level qualification services.",
|
||
"ceo": "Charles Hosono (appointed CEO Feb 2026)",
|
||
"contact_person": "Frédéric Valentin",
|
||
"contact_role": "Vice President, Sales & Marketing",
|
||
"contact_email": "frederic.valentin@presto-eng.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://fr.linkedin.com/in/fredericvalentin/",
|
||
"notes": "Confirmed via Presto's own Management Team page, cross-checked against LinkedIn. Strong BD-angle match. Alternate: Didier Narassiguin, VP IP & NPI (R&D Lead angle) - linkedin.com/in/didier-narassiguin-735096b/, found via search but not independently re-verified. | Email pattern-inferred (2026-08-27), confidence notes: name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-7c3cdb21",
|
||
"category": "Device Testing",
|
||
"name": "Aehr Test Systems",
|
||
"location": "Fremont, California, USA",
|
||
"website": "https://www.aehr.com",
|
||
"source": "sweep",
|
||
"reason": "States it is the leader in wafer-level burn-in specifically for SiC and GaN devices — directly on-topic for WBG device qualification, feeding failure-mode data back to fabs/designers.",
|
||
"ceo": "Gayn Erickson, President & CEO",
|
||
"contact_person": "Didier Wimmers",
|
||
"contact_role": "Executive Vice President, Research and Development (joined March 2025)",
|
||
"contact_email": "didier.wimmers@aehr.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Confirmed via Aehr's own About Us page, no LinkedIn found. Alternate: Scott Lindsey, Staff Scientist, recognized reliability-testing expert - linkedin.com/in/scottearllindsey/ - found via search but could not be fetched/verified directly (LinkedIn bot-blocking), unconfirmed. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; underlying contact identity itself was flagged uncertain in prior research. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-67c0f273",
|
||
"category": "Device Testing",
|
||
"name": "Ansys Reliability Engineering Services (formerly DfR Solutions)",
|
||
"location": "College Park, Maryland, USA",
|
||
"website": "https://www.ansys.com",
|
||
"source": "sweep",
|
||
"reason": "Independent reliability lab (20,000 sq ft facility): accelerated life testing, failure analysis, component reliability and materials characterization.",
|
||
"ceo": "not found (declined to report generic Ansys corporate CEO - out of scope for this division)",
|
||
"contact_person": "Michael (Mike) Howard",
|
||
"contact_role": "Director, Electronics Reliability / RES Manager, Ansys Reliability Engineering Services",
|
||
"contact_email": "michael.howard@ansys.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/michael-howard-a4218378/",
|
||
"notes": "Multiple independent sources consistently place him leading the former-DfR-Solutions reliability services team, though exact title varies slightly across sources. Reasonably confident on person/company match. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-6713e885",
|
||
"category": "Device Testing",
|
||
"name": "EAG Laboratories",
|
||
"location": "Multiple US/global sites",
|
||
"website": "https://www.eag.com",
|
||
"source": "sweep",
|
||
"reason": "Independent reliability/qualification lab offering HTOL, thermal shock, preconditioning, THB, and HAST testing services.",
|
||
"ceo": "not found (declined generic Eurofins corporate CEO - out of scope for this division)",
|
||
"contact_person": "C. S. Aw",
|
||
"contact_role": "Business Development Director, Eurofins EAG Laboratories (Singapore)",
|
||
"contact_email": "c..aw@eag.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/c-s-aw-0ab48278/",
|
||
"notes": "Strong BD-angle match, title explicit in profile summary. Global/APAC site rather than US, acceptable given EAG has multiple US/global sites. A US-based alternate (Canh Ly, Sunnyvale CA) was ruled out - he has since left EAG for Ultra Clean Technology. | Email pattern-inferred (2026-08-27), confidence notes: name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-46364764",
|
||
"category": "Device Testing",
|
||
"name": "Element Materials Technology (formerly NTS)",
|
||
"location": "London, UK (global sites)",
|
||
"website": "https://www.element.com",
|
||
"source": "sweep",
|
||
"reason": "Broad qualification/certification testing services including a defense/space division (Element U.S. Space and Defense); a general provider rather than SiC/GaN-specific, useful as a large umbrella contact.",
|
||
"ceo": "not found (declined generic Element Group CEO - out of scope for this division)",
|
||
"contact_person": "Russell Shepherd",
|
||
"contact_role": "Technical Director – Electronics (Element Anaheim)",
|
||
"contact_email": "russell.shepherd@element.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Confirmed name/title directly from Element's own \"Our Experts\" page - strong, specific match to the semiconductor/electronics test division. LinkedIn UNCONFIRMED - multiple people share this name, could not cross-reference before search access exhausted. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; underlying contact identity itself was flagged uncertain in prior research; name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-10948b39",
|
||
"category": "Radiation Hardness",
|
||
"name": "RADNEXT (CERN-coordinated)",
|
||
"location": "EU",
|
||
"website": "https://radnext.web.cern.ch",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. European irradiation facility network.",
|
||
"ceo": "",
|
||
"contact_person": "Ruben Garcia Alia",
|
||
"contact_role": "RADNEXT Project Coordinator (CERN)",
|
||
"contact_email": "ruben.alia@radnext.web.cern.ch [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/ruben-garcia-alia/",
|
||
"notes": "LinkedIn confirmed - profile activity discusses RADNEXT 2030 and access to irradiation facilities, consistent with the role. High confidence. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-00170fe3",
|
||
"category": "Radiation Hardness",
|
||
"name": "ESA ESTEC / TEC-QEC",
|
||
"location": "Netherlands",
|
||
"website": "https://www.esa.int/Enabling_Support/Space_Engineering_Technology/Radiation_a_testing_challenge",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Radiation hardness assurance for space. No dedicated public TEC-QEC page found — linked to ESA's general radiation-testing overview instead; ESCIES (escies.org) is the closest detailed public resource.",
|
||
"ceo": "",
|
||
"contact_person": "Alessandra Costantino",
|
||
"contact_role": "Radiation Test Facilities Engineer, TEC-QEC",
|
||
"contact_email": "alessandra.costantino@esa.int [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "LinkedIn URL found (linkedin.com/in/alessandra-costantino-283bba12b/) but NOT used - profile's stated current affiliation is Università degli Studi di Bari, not ESA/ESTEC. Could mean she's a contractor/collaborator, or a different Alessandra Costantino entirely (name returned several unrelated matches). Do not use without manual verification of current employer. | Follow-up pass (2026-08-23): confirmed she is employed via contractor firm HeSpace working for ESA at TEC-QEC, not an ESA direct hire. The previously-flagged LinkedIn profile is now confidently ruled out as a different person (her real background per a 2022 conference bio - Politecnico di Milano, Radiation Hardness Assurance section - conflicts with that profile's stated PhD/Bari/Earth-Observation background). No confirmed LinkedIn exists for the real Alessandra Costantino. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-94925383",
|
||
"category": "Radiation Hardness",
|
||
"name": "Paul Scherrer Institute (PSI)",
|
||
"location": "Switzerland",
|
||
"website": "https://www.psi.ch/en",
|
||
"source": "peter",
|
||
"reason": "Peter's Phase 1 list. Proton irradiation facility.",
|
||
"ceo": "Prof. Dr. Christian Rüegg (Director, PSI, since 2020)",
|
||
"contact_person": "Dr. Malte Hildebrandt",
|
||
"contact_role": "Group Leader, Proton Irradiation Facility (PIF), PSI",
|
||
"contact_email": "..hildebrandt@psi.ch [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Confirmed via PSI's own PIF facility page, high confidence on name/role. LinkedIn search only returned unrelated same-name people - left blank rather than guess. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-70c8e788",
|
||
"category": "Radiation Hardness",
|
||
"name": "BAE Systems — Space Systems",
|
||
"location": "Manassas, Virginia, USA (global HQ Farnborough, UK)",
|
||
"website": "https://baesystems.com",
|
||
"source": "sweep",
|
||
"reason": "Produces the RAD5545/RAD750 radiation-hardened space processor line at a DoD Category 1A Trusted Source facility; long NASA/DoD track record.",
|
||
"ceo": "Joseph \"Joe\" Dziezynski (Director, Space Systems Product Line, BAE Systems Manassas) - LinkedIn found (linkedin.com/in/joseph-dziezynski-327b313a) but not exhaustively cross-checked",
|
||
"contact_person": "Paul Nixon",
|
||
"contact_role": "Sr. Principal Engineer, Quality Assurance (oversees Manassas facility QMS/QML program)",
|
||
"contact_email": "paul.nixon@baesystems.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/paul-nixon-47939615/",
|
||
"notes": "Nixon's profile ties his history to the Manassas site's IBM Federal Systems -> Loral -> Lockheed Martin -> BAE Systems lineage, good confidence. Global BAE Systems plc CEO not listed since this is division-specific. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-5a32e899",
|
||
"category": "Radiation Hardness",
|
||
"name": "Teledyne e2v",
|
||
"location": "Chelmsford, Essex, UK",
|
||
"website": "https://teledyne-e2v.com",
|
||
"source": "sweep",
|
||
"reason": "Produces radiation-hardened data converters, microprocessors, and custom ASICs for space/avionics.",
|
||
"ceo": "David Hien (VP & GM, Semiconductors Division, Teledyne e2v, announced Sept 2025) - may not be top exec for the whole Chelmsford/Space Imaging operation, unclear vs. older \"Phil Nicholson\" title",
|
||
"contact_person": "Jack Mills",
|
||
"contact_role": "Product Verification & Test Engineer, Chelmsford, UK",
|
||
"contact_email": "jack.mills@teledyne-e2v.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/jack-mills-b26b09a/",
|
||
"notes": "Moderate confidence - LinkedIn URL from search snippets only, direct profile fetch failed so title/employer not independently re-verified. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-081e546e",
|
||
"category": "Radiation Hardness",
|
||
"name": "VORAGO Technologies",
|
||
"location": "Austin, Texas, USA",
|
||
"website": "https://voragotech.com",
|
||
"source": "sweep",
|
||
"reason": "Rad-hard MCUs/components for space and nuclear environments via a proprietary HARDSIL process; specifics mostly sourced from company material, limited independent confirmation.",
|
||
"ceo": "Bernd Lienhard (CEO) - LinkedIn confirmed: https://www.linkedin.com/in/berndlienhard/",
|
||
"contact_person": "Brad Boyer",
|
||
"contact_role": "VP, Global Sales & Business Development",
|
||
"contact_email": "brad.boyer@voragotech.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Appointment confirmed via company press coverage, but LinkedIn profile could not be isolated among many unrelated \"Brad Boyer\" profiles. Alternate with confirmed LinkedIn: Garry Nash, COO (oversees Quality/Test/Ops) - linkedin.com/in/garrynash - role fits less precisely but is a safer fallback. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-2fcb2473",
|
||
"category": "Radiation Hardness",
|
||
"name": "Heavy Ion Facility, Université catholique de Louvain (UCLouvain)",
|
||
"location": "Louvain-la-Neuve, Belgium",
|
||
"website": "https://www.uclouvain.be/en/research-institutes/irmp/heavy-ion-facility-hif",
|
||
"source": "sweep",
|
||
"reason": "ESA-preferred external single-event-effects test facility (CYCLONE cyclotron); a potential collaborator/co-location partner rather than a paying customer.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Dr. Carmen Angulo",
|
||
"contact_role": "Cyclotron Coordinator, Centre de Ressources du Cyclotron (CRC) / Heavy Ion Facility, UCLouvain",
|
||
"contact_email": "..angulo@uclouvain.be [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Name/role confirmed via CERN RD50 irradiation-facilities page and CRC contact info. A \"Carmen Angulo\" LinkedIn profile found lists SCK CEN (Belgian Nuclear Research Centre, Mol) - a DIFFERENT institution - so not used; could be an outdated employer field or a different person. Left unconfirmed. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; underlying contact identity itself was flagged uncertain in prior research. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-1c8a83fd",
|
||
"category": "Radiation Hardness",
|
||
"name": "TTM Technologies",
|
||
"location": "Costa Mesa, California, USA",
|
||
"website": "https://www.ttm.com",
|
||
"source": "sweep",
|
||
"reason": "Supplier of rad-hard microcircuits to aerospace/space/defense, certified to MIL-PRF-38534 Class H and Class K (space-grade).",
|
||
"ceo": "Dr. Edwin Roks (President & CEO, appointed Sept 2025, ex-Teledyne Technologies CEO)",
|
||
"contact_person": "Anup Singh",
|
||
"contact_role": "Senior Business Development Executive (Rad-Hard/Rad-Tolerant, Aerospace & Defense/Space)",
|
||
"contact_email": "anup.singh@ttm.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/mistersingh/",
|
||
"notes": "Highest-confidence match in this category - profile directly fetched, confirms rad-hard/space BD work at TTM including RADECS 2025 and Space Tech Expo activity. | Email pattern-inferred (2026-08-27), confidence notes: name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-d4ba5d1c",
|
||
"category": "Radiation Hardness",
|
||
"name": "Data Device Corporation (DDC)",
|
||
"location": "Bohemia, New York, USA (Center of Excellence in Poway, CA)",
|
||
"website": "https://www.ddc-web.com",
|
||
"source": "sweep",
|
||
"reason": "Runs a \"Center of Excellence for Radiation Tolerant Microelectronics and Single Board Computers,\" qualified to MIL-PRF-38534/38535.",
|
||
"ceo": "Adam Crossman (President, DDC) - confirmed via company press release, no matching LinkedIn found among common-name results",
|
||
"contact_person": "Frank Bloomfield",
|
||
"contact_role": "Aerospace New Business Development / Engineering (~25 yrs experience)",
|
||
"contact_email": "frank.bloomfield@ddc-web.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/frank-bloomfield-6251765/",
|
||
"notes": "Profile confirms DDC affiliation and BD/engineering focus, but exact current title not fully visible in the scrape - reasonably confident, not 100%. | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-6f7596f6",
|
||
"category": "Radiation Hardness",
|
||
"name": "Frontgrade Gaisler",
|
||
"location": "Gothenburg, Sweden",
|
||
"website": "https://www.gaisler.com",
|
||
"source": "sweep",
|
||
"reason": "Maker of rad-hard LEON-family processors (GR712RC, GR740) flown on hundreds of spacecraft; GR740 designated ESA's \"Next Generation Microprocessor,\" close ESA/industry ties.",
|
||
"ceo": "Sandi Habinc (General Manager) - LinkedIn confirmed: https://www.linkedin.com/in/sandi-habinc-ba8657151/, Gothenburg-based, matches GM role",
|
||
"contact_person": "Emily Pavlovic",
|
||
"contact_role": "Quality Manager, Frontgrade Gaisler",
|
||
"contact_email": "emily.pavlovic@gaisler.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Name/title came directly from Gaisler's own official team page - strong role match - but no LinkedIn profile located before search budget ran out. Alternate on same page: Annalena Johansson, Business Development Manager, also no LinkedIn located. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-07e7e8b5",
|
||
"category": "Radiation Hardness",
|
||
"name": "RADEF (Radiation Effects Facility), University of Jyväskylä",
|
||
"location": "Jyväskylä, Finland",
|
||
"website": "https://www.jyu.fi",
|
||
"source": "sweep",
|
||
"reason": "ESA-supported European Component Irradiation Facility (since 2005) providing proton/heavy-ion/electron irradiation testing for space electronics, used by ESA, NASA, JAXA, CNES and European industry — a peer facility to the already-listed PSI and UCLouvain sites.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Heikki Kettunen",
|
||
"contact_role": "Staff Scientist (primary contact for beam-time requests / general inquiries), RADEF",
|
||
"contact_email": "heikki.kettunen@jyu.fi [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Confirmed via RADEF's own official facility page as the named beam-time contact - good facility-lead equivalent. No LinkedIn found before search budget exhausted. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-d89a8ef1",
|
||
"category": "Radiation Hardness",
|
||
"name": "Microchip Technology (rad-hard/rad-tolerant line)",
|
||
"location": "Chandler, Arizona, USA",
|
||
"website": "https://www.microchip.com",
|
||
"source": "sweep",
|
||
"reason": "Same company as the Power Electronics (Devices) entry above, listed here separately for its distinct aerospace rad-hard/rad-tolerant product line — states it offers one of the widest selections of rad-hard/rad-tolerant parts for space.",
|
||
"ceo": "not confirmed this session - division-specific top executive not identified; company-wide CEO not cited here since it isn't rad-hard-line-specific (see separate \"Microchip Technology\" entry in Power Electronics category for corporate CEO)",
|
||
"contact_person": "Nicolas Ganry",
|
||
"contact_role": "Senior Product Manager, Aerospace & Defense (rad-hard devices)",
|
||
"contact_email": "nicolas.ganry@microchip.com [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "LOWEST CONFIDENCE in this category - name/role from a single secondary web source, not Microchip's own site (direct fetch returned 403) nor a verified LinkedIn profile. Treat as a lead to verify manually, not a confirmed contact. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-46d86d81",
|
||
"category": "Research & Collaborations",
|
||
"name": "Stony Brook University — Laboratory for Synchrotron X-ray Topography",
|
||
"location": "Stony Brook, New York, USA",
|
||
"website": "https://you.stonybrook.edu/xraycharacterization/",
|
||
"source": "sweep",
|
||
"reason": "PI Michael Dudley publishes synchrotron X-ray topography of GaN and 4H-SiC power-device material (ARPA-E sponsored) — the single most directly on-topic match found in this sweep.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Michael Dudley",
|
||
"contact_role": "Professor & Lab Director, Materials Science and Chemical Engineering; also Director, onsemi Research Center for Wide Bandgap Materials",
|
||
"contact_email": "michael.dudley@you.stonybrook.edu [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/michael-dudley-b3443224/",
|
||
"notes": "Strong fit - direct match to synchrotron X-ray defect characterization service. LinkedIn URL has minor uncertainty (two similar-suffix profile URLs found for what appears to be the same person; a clearly unrelated \"hospital grounds\" Michael Dudley also surfaced and was excluded). Contact page: you.stonybrook.edu/xraycharacterization/contact-us/ | Email pattern-inferred (2026-08-27), confidence notes: standard. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-02d0a6ad",
|
||
"category": "Research & Collaborations",
|
||
"name": "ETH Zurich — Advanced Power Semiconductor Laboratory",
|
||
"location": "Zurich, Switzerland",
|
||
"website": "https://aps.ee.ethz.ch/",
|
||
"source": "sweep",
|
||
"reason": "Prof. Ulrike Grossner's group published 2025 work on defect formation in heavy-ion-degraded SiC power MOSFETs — a natural bridge between the WBG-device and rad-hardness divisions.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Prof. Dr. Ulrike Grossner",
|
||
"contact_role": "Professor of Power Semiconductors / Head, APS Laboratory (lab head since 2015)",
|
||
"contact_email": "..grossner@aps.ee.ethz.ch [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/ugrossner/",
|
||
"notes": "Confident match - Zurich location listed, consistent with role. Strong fit for wide-bandgap (SiC/GaN) materials/device research. | Email pattern-inferred (2026-08-27), confidence notes: academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-d41f4243",
|
||
"category": "Research & Collaborations",
|
||
"name": "Vanderbilt University — Institute for Space and Defense Electronics",
|
||
"location": "Nashville, Tennessee, USA",
|
||
"website": "https://www.vanderbilt.edu/isde/",
|
||
"source": "sweep",
|
||
"reason": "Schrimpf/Fleetwood group has a long DTRA/ONR-funded track record studying radiation effects in GaN/SiC materials and devices — a strong potential co-authorship partner.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Brian Sierawski",
|
||
"contact_role": "Director, Institute for Space and Defense Electronics (ISDE)",
|
||
"contact_email": "brian.sierawski@vanderbilt.edu [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/brian-sierawski-7213886/",
|
||
"notes": "Reasonably confident. Note: ISDE recently changed leadership - founding director Ronald Schrimpf stepped back to a professorship, Mike Alles is now Associate Director. Sierawski focuses on radiation effects/single-event effects, more device-reliability/radiation-testing oriented than materials-defect X-ray imaging - still relevant, just a slightly different angle. Verify currency before outreach. | Email pattern-inferred (2026-08-27), confidence notes: name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-389f6232",
|
||
"category": "Research & Collaborations",
|
||
"name": "University of Warwick — PEATER group",
|
||
"location": "Coventry, UK",
|
||
"website": "https://warwick.ac.uk/fac/sci/eng/research/grouplist/electricalpower/peater/",
|
||
"source": "sweep",
|
||
"reason": "Prof. Philip Mawby's 20+ year, ~25-researcher group is a major UK academic center for SiC power device/materials research that could want defect/epitaxy X-ray characterization support.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Philip Mawby",
|
||
"contact_role": "Professor of Power Electronics; Head of PEATER Group; Head of Electronics, Power and Microsystems",
|
||
"contact_email": "philip.mawby@warwick.ac.uk [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/phil-mawby-73154642/",
|
||
"notes": "UNCONFIRMED - moderately confident only (posts reference WiPDA-Europe/EVTec conferences consistent with his field, but several other unrelated \"Phil/Philip Mawby\" profiles exist). Verify before outreach. Alternate contact: Prof. Peter Gammon, same group, leads SiC power device research specifically - may be a tighter fit. | Email pattern-inferred (2026-08-27), confidence notes: underlying contact identity itself was flagged uncertain in prior research; academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-a5b031af",
|
||
"category": "Research & Collaborations",
|
||
"name": "NASA Goddard Space Flight Center — NEPP Program",
|
||
"location": "Greenbelt, Maryland, USA",
|
||
"website": "https://nepp.nasa.gov/",
|
||
"source": "sweep",
|
||
"reason": "Runs heavy-ion/TID radiation qualification studies on SiC/GaN power devices for spaceflight. A government research program, not a company — engagement would follow a different channel than a commercial prospect.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Peter (Pete) J. Majewicz",
|
||
"contact_role": "NEPP Program Manager, NASA/GSFC",
|
||
"contact_email": "peter.majewicz@nepp.nasa.gov [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "No LinkedIn found (normal for this role). Confirmed current as of 2025 workshop materials. Use official contact channel only: nepp.nasa.gov/pages/Contact-NEPP.cfm - do not use scraped email addresses per compliance guidance. Deputy Manager Susana Douglas is a secondary contact. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-f54a8717",
|
||
"category": "Research & Collaborations",
|
||
"name": "Nagoya University — Center for Integrated Research of Future Electronics",
|
||
"location": "Nagoya, Japan",
|
||
"website": "https://imass.nagoya-u.ac.jp/en/organization/cirfe/",
|
||
"source": "sweep",
|
||
"reason": "Active in X-ray topography defect analysis of GaN substrates, appearing in recent (2026) published work on SiC/GaN crystal defect characterization — a plausible co-authorship/joint-beamtime partner for the APAC region.",
|
||
"ceo": "Hiroshi Amano (Director, CIRFE since 2015; 2014 Nobel Laureate in Physics)",
|
||
"contact_person": "Hiroshi Amano",
|
||
"contact_role": "Director, CIRFE; Professor, Institute of Materials and Systems for Sustainability (IMaSS)",
|
||
"contact_email": "hiroshi.amano@imass.nagoya-u.ac.jp [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "No LinkedIn found (two \"Hiroshi Amano\" profiles found are clearly different people - a video-production owner and a renewable-energy sales director - neither matches). Very high-profile (Nobel laureate) - likely routed through admin staff rather than reached directly. Worth identifying a CIRFE power-electronics deputy/section lead as a more responsive first contact. | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-dc29501a",
|
||
"category": "Research & Collaborations",
|
||
"name": "Linköping University — C3NiT-Janzén Center",
|
||
"location": "Linköping, Sweden",
|
||
"website": "https://c3nit.se/",
|
||
"source": "sweep",
|
||
"reason": "VINNOVA-funded Center for III-Nitride Technology (Erik Janzén group), deep publication record on GaN/SiC materials defects and epitaxy, with direct industry ties to SweGaN (already listed under Semiconductor Materials & Substrates) and to Ericsson/Saab.",
|
||
"ceo": "Vanya Darakchieva (Centre Director)",
|
||
"contact_person": "Vanya Darakchieva",
|
||
"contact_role": "Centre Director, C3NiT-Janzén; Professor, Semiconductor Materials, Linköping University",
|
||
"contact_email": "vanya.darakchieva@c3nit.se [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/vanya-darakchieva-7890129",
|
||
"notes": "Confident match - multiple posts explicitly reference C3NiT activity, confirmed via center contact page. Good fit: III-nitride power/high-frequency semiconductor materials. Center named for founding figure Erik Janzén, but Darakchieva is current operational director. | Email pattern-inferred (2026-08-27), confidence notes: academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-59d1103a",
|
||
"category": "Research & Collaborations",
|
||
"name": "Chalmers University of Technology",
|
||
"location": "Gothenburg, Sweden",
|
||
"website": "https://www.chalmers.se/en/",
|
||
"source": "sweep",
|
||
"reason": "Distinct from Linköping — collaborates with SweGaN, Ericsson and Saab on GaN power-amplifier work, most recently a 2025 6G GaN project.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Niklas Rorsman",
|
||
"contact_role": "Research Professor, GaN/wide-bandgap power & microwave semiconductor devices, Dept. of Microtechnology and Nanoscience (MC2)",
|
||
"contact_email": "niklas.rorsman@chalmers.se [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "https://www.linkedin.com/in/niklas-rorsman-5693472/",
|
||
"notes": "Confident match - Gothenburg location consistent. Chalmers has no single dedicated \"power semiconductor lab\" brand; Rorsman's group (GaN-on-SiC HEMTs) inside MC2 is closest fit. Chalmers is also a partner in the C3NiT network (see Linköping entry) - possible cross-referral. | Email pattern-inferred (2026-08-27), confidence notes: academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-fac5233b",
|
||
"category": "Research & Collaborations",
|
||
"name": "Fraunhofer IISB",
|
||
"location": "Erlangen, Germany",
|
||
"website": "https://www.iisb.fraunhofer.de/",
|
||
"source": "sweep",
|
||
"reason": "Research institute performing full-wafer-scale X-ray topography defect mapping of SiC substrates/epilayers up to 200mm, plus device fabrication/characterization on a qualified 150mm SiC line — a very concrete fit, and geographically close to DESY.",
|
||
"ceo": "Prof. Dr.-Ing. Jörg Schulze (Institute Director since Sept 2021)",
|
||
"contact_person": "Jörg Schulze",
|
||
"contact_role": "Institute Director, Fraunhofer IISB; also holds Chair of Electronic Devices, FAU Erlangen-Nürnberg",
|
||
"contact_email": "jorg.schulze@iisb.fraunhofer.de [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "LinkedIn NOT included - a \"Jörg Schulze - Bayern Innovativ GmbH\" profile surfaced but the listed employer does not match his stated Fraunhofer IISB director role (could be an outdated listing or same-name mismatch). Do not use without independent verification. Topical fit is strong (prior SiC power electronics research background from Stuttgart institute). | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; name has diacritics, ASCII-simplified for the email guess, real convention may differ. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
},
|
||
{
|
||
"id": "ps-50b00a9b",
|
||
"category": "Research & Collaborations",
|
||
"name": "ESRF — Rocking-Curve Imaging group",
|
||
"location": "Grenoble, France",
|
||
"website": "https://www.esrf.fr/home/Industry/industry-news/content-news/esrf-news-list/semiconductor-defect-imaging.html",
|
||
"source": "sweep",
|
||
"reason": "A peer synchrotron facility (not a customer) that developed rocking-curve imaging specifically for SiC/GaN defect imaging and has published industry-facing material on it — useful as a model/comparator or potential collaborator contact.",
|
||
"ceo": "not applicable",
|
||
"contact_person": "Thu Nhi Tran Caliste",
|
||
"contact_role": "Industrial Liaison Engineer, Topography/Rocking Curve Imaging, BM05 beamline",
|
||
"contact_email": "thu.caliste@esrf.fr [UNVERIFIED PATTERN GUESS - NOT CONFIRMED, not found in any public source]",
|
||
"contact_linkedin": "",
|
||
"notes": "Arguably the single best-fit contact on the whole 73-company list - an Industrial Liaison Engineer role for the exact RCI/X-ray topography technique TXproducts offers; BM05 explicitly serves semiconductor/power-electronics industry clients. No LinkedIn found. Secondary contact: Benoît Cordonnier (scientist in charge of BM05). Contact page: esrf.fr/home/UsersAndScience/Experiments/StructMaterials/BM05/Contacts.html | Email pattern-inferred (2026-08-27), confidence notes: no LinkedIn confirmed for this contact either; academic/research org - email convention may differ from firstname.lastname. Not found in any public source - guessed format only, must not be used for cold outreach without independent confirmation.",
|
||
"priority_rank": "",
|
||
"priority_tier": "",
|
||
"materials": "",
|
||
"ranking_rationale": ""
|
||
}
|
||
]
|
||
}
|