Expand Prospect Scout verification note to full methodology detail

Was condensed to a single paragraph, dropping useful transparency
(excluded weak-evidence candidate, pre-commercial flag, query-phrasing
insight behind Round 2's Power Electronics gap-fill, unverified pricing
caveat). Restructured as a bulleted list covering both rounds in full,
since this detail matters for judging how much to trust each entry.
This commit is contained in:
beantownbabe committed 2026-08-22 09:25:54 +02:00
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commit b1098b8a32
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@@ -1246,10 +1246,40 @@ var PROSPECT_RESULTS = [
{ division: "Research & Collaborations", name: "ESRF — Rocking-Curve Imaging group", location: "Grenoble, France", source: "sweep",
reason: "A peer synchrotron facility (not a customer) that developed rocking-curve imaging specifically for SiC/GaN defect imaging and has published industry-facing material on it — useful as a model/comparator or potential collaborator contact." }
];
var PROSPECT_METHODOLOGY = "Two rounds (2026-08-22). Round 1: broad first-pass worldwide sweep, merged with Peter's Phase 1 Contact List (25 entries) — his two device-side categories kept separate rather than combined, plus 2 genuinely new divisions (Semiconductor Materials & Substrates, Research & Collaborations) this sweep surfaced that his list didn't have. Round 2: gap-filling pass explicitly told what Round 1 + Peter's list already covered, to avoid re-finding the same names — pushed hardest on Power Electronics (Devices), which Round 1 had only independently found 4 of Peter's 12 established players for; added 5 more major established manufacturers there (Mitsubishi Electric, Fuji Electric, Nexperia, Semikron Danfoss, Microchip Technology). 73 entries total. Each card is tagged by where it came from: Peter's list, this sweep, or both. Some entries are corporate subsidiaries of larger parents (GeneSiC/Navitas, Powdec/Sanken, UnitedSiC/Qorvo, GaN Systems/Renesas, Transphorm/Infineon) — flagged so outreach can target the subsidiary's technical team or route through the parent's BD channel as appropriate. TekSiC is flagged pre-commercial (no customer-validation wafers until mid-2027). Not exhaustive — skews toward English-language sources; some entries rely more on company-published material than independent confirmation. Treat every entry as a lead requiring direct verification before outreach or budget commitment, not a confirmed relationship.";
var PROSPECT_METHODOLOGY_INTRO = "Methodology / Verification Note — two rounds, 2026-08-22:";
var PROSPECT_METHODOLOGY = [
"Round 1: broad first-pass worldwide web-research sweep, cross-checking each entry's HQ across at least two independent sources (company site plus trade press, directory, or government source) where possible.",
"Merged with Peter's Phase 1 Contact List (25 entries) the same day — his two device-side categories (Power Electronics (Devices) and WBG Device Manufacturer) kept separate rather than combined, plus 2 new divisions this sweep surfaced that his list didn't have (Semiconductor Materials & Substrates, Research & Collaborations).",
"Round 2: gap-filling pass, explicitly told what Round 1 + Peter's list already covered so it wouldn't re-find the same names. Caught one near-miss (Reltech Limited resurfaced in a Device Testing search, excluded as a duplicate).",
"Round 2 pushed hardest on Power Electronics (Devices) — Round 1 had only independently found 4 of Peter's 12 established players there. Added 5 more (Mitsubishi Electric, Fuji Electric, Nexperia, Semikron Danfoss, Microchip). The original under-coverage looks like a query-phrasing issue (searches for \"top SiC/GaN power device companies\" underweight Japanese/German majors) rather than true scarcity of targets — worth the same treatment for other divisions in a future round.",
"Research & Collaborations already had strong US/UK coverage (Stony Brook, Vanderbilt, Warwick); Round 2 added Japan (Nagoya) and 2 more EU institutions (Linköping, Chalmers, Fraunhofer IISB), plus flagged ESRF itself as a potential facility-level collaborator, not only a university group.",
"73 total entries. Several are corporate subsidiaries of larger parents rather than fully independent companies (GeneSiC/Navitas, Powdec/Sanken, UnitedSiC-Qorvo, GaN Systems/Renesas, Transphorm/Infineon) — flagged per entry so outreach can target the subsidiary's technical team directly or route through the parent's BD channel.",
"One candidate (Littelfuse, Power Electronics (Devices)) was found but excluded — only a single trade-show mention, evidence too thin to include at the same confidence as the rest.",
"TekSiC (Semiconductor Materials & Substrates) is flagged pre-commercial — no customer-validation wafers expected until mid-2027.",
"No irradiation-facility or test-lab pricing/access terms were verified — that requires direct outreach, not search. No paywalled/subscription-only sources were used; all citations are publicly accessible.",
"Not exhaustive — skews toward English-language sources; some entries, particularly Chinese manufacturers, rely more on company-published material than independent third-party confirmation.",
"Each card is tagged by where it came from: Peter's list, this sweep, or both. Treat every entry as a lead requiring direct verification before outreach or budget commitment, not a confirmed relationship."
];
function renderProspectScout() {
var noteEl = document.getElementById('prospect-scout-note');
if (noteEl) noteEl.textContent = PROSPECT_METHODOLOGY;
if (noteEl) {
noteEl.innerHTML = '';
var introEl = document.createElement('div');
introEl.style.fontWeight = '800';
introEl.style.marginBottom = '8px';
introEl.textContent = PROSPECT_METHODOLOGY_INTRO;
noteEl.appendChild(introEl);
var list = document.createElement('ul');
list.style.margin = '0';
list.style.paddingLeft = '20px';
PROSPECT_METHODOLOGY.forEach(function (item) {
var li = document.createElement('li');
li.style.marginBottom = '6px';
li.textContent = item;
list.appendChild(li);
});
noteEl.appendChild(list);
}
var container = document.getElementById('prospect-scout-groups');
if (!container) return;
container.innerHTML = '';